Castings for Semiconductor and Liquid Crystal Production 토토사이트 회원가입 안시켜줌

Based on 140 years of experience in production of castings such as marine engines, Kanadevia is now expanding into castings for precision machinery such as semiconductor and liquid crystal devices.The key 토토사이트 회원가입 안시켜줌 in this area is lapping plates made from a specially formulated ductile cast iron that are designed to produce thinner and smoother silicon wafers, glass substrates, sapphire substrates, and compound semiconduct precision.
Major products
Lapping plates

Our lapping plates are designed for lapping various advanced materials that support next-generation information technology. We can provide optimum lapping grade materials tailored to customers' needs with our large selection of products.This approach allows an integrated production process from melting and casting through to machining, which can be used in a variety of IT and precision machinery fields.For larger dimensions, 토토사이트 회원가입 안시켜줌 uses modern machine tools for precision processing to high standards of accuracy.
Dressing gear

Dressing gear is needed to maintain the flatness and condition of the surface of a lapping plate, and is indispensable in ensuring an even flatness of various wafers. We provide dressing gears suiping for.
Polishing plates

High-precision polishing plates provide a mirror finish on glass substrates for liquid crystal panels, color filters, and various wafers such as silicon and compound semiconductors. We select the material and conduct surface treatment accord'
Pad dressers

We supply carriers for holding thin substrate such as silicon wafers for the purpose of lapping and polishing. We select carrier thickness to match the work and materials, including blue steel, forin stering our wealth of experience and technological development.
Lapping and polishing carriers

We supply carriers for holding thin such as silicon wafers for the purpose of lapping and polishing. We select carrier thickness to match the work and materials, including blue steel, stainless steel, and plastic, and provide of experience and technological development.
프로파일 측정 시스템

The profile measurement system is used to control the shape of lapping and polishing plates. Measurements in the upper and lower directions are possible and models measuring in length from 1,000 mm to 3,500 mm are available. As we that have not been seen so far, we enable effective control for improving accuracy.
Slurry 재활용 시스템

This system is used to refresh the slurry for reuse through de-ironing, filtering, classifying, and blending processes. Reusable abrasives are collected from the slurry following lapping of wafers and glass and system it is possible to reduce the cost of abrasives by more than 50% (according to our survey).
Related technology
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